Gecko Materials Launches New Products at TechCrunch Disrupt 2024

geCKo Materials Advances Commercialization with New Adhesive Applications
geCKo Materials, the 2024 runner-up in the TechCrunch Disrupt Startup Battlefield, showcased its latest product developments as it progresses toward wider commercial adoption of its innovative technology.
New Applications of geCKo’s Dry Adhesive
Dr. Capella Kerst, the founder of geCKo Materials, unveiled four novel applications leveraging the exceptional strength of their dry adhesive. These include a specialized tool for handling semiconductor wafers, a robotic gripper designed for smooth surfaces like solar panels and glass, a curved robotic “end effector” for grasping irregular shapes, and a versatile gripper suitable for various robotic arms.
Inspired by Nature: A Novel Adhesive Technology
The core technology behind geCKo is modeled after the gripping mechanisms found in the feet of lizards. Dr. Kerst describes it as a next-generation alternative to Velcro, offering advantages such as a residue-free operation, rapid attachment and detachment, and the elimination of the need for electrical charges or suction.
A single one-inch tile of the material is capable of supporting 16 pounds. Furthermore, the geCKo dry adhesive can endure up to 120,000 attachment cycles, maintaining adhesion for durations ranging from seconds to years.
Rapid Adoption by Industry Leaders
The adaptability of this dry adhesive to existing manufacturing processes, picking systems, and robotic applications has garnered significant interest. Prior to its appearance on last year’s Battlefield stage, geCKo had already secured contracts with prominent organizations including Ford, NASA, and Pacific Gas & Electric.
Growth and Expansion
“It’s remarkable how quickly this year has passed, hasn’t it?” Dr. Kerst remarked during her presentation at TechCrunch Disrupt on Wednesday. Since last year’s event, geCKo Materials has tripled its team size and successfully completed an $8 million funding round.
The company’s dry adhesive technology has also been utilized in six space missions over the past year, demonstrating its ability to function effectively in diverse environments, including the vacuum of space.
Demonstration and Performance
During the Wednesday presentation, Dr. Kerst demonstrated a Fanuc robotic arm equipped with six geCKo tiles, showcasing its ability to swiftly grasp and manipulate objects. She also presented videos illustrating the other commercial applications of the technology.
Accelerated Wafer Handling
One video highlighted the use of geCKo’s material in the safe and rapid transfer of semiconductor wafers, exceeding the speed capabilities of conventional suction or vacuum technologies.
“Our clients at TSMC, Samsung, Intel, and Kawasaki expressed a need to move wafers at 2Gs of acceleration,” she explained. “We surpassed this goal, achieving a repeatable and reliable acceleration of 5.4Gs using geCKo materials.”
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